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CPU AGB A E供应信息

CPU AGB A E原装现货
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cpu agb a e PDF Datasheet 资料

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描述:Specification: 1. Adhesive force: 3.5 kg/inch 2. Holding force: >60 hrs/inch2 100ºC 3. Weight lose:<1 @204ºC/24 Hr 4. Specific gravity:1.85±0.1 g/cm3 5. Hardness:15-25 ASTM D2240 6. Withstand voltage:>2.5 KV/mm 7. Fire resistance: V-0 UL-94 8. Volume resistivity: 1.2*10 1 Ω.CM ASTM D257 9. Temperature scope:-20~+180ºC EN 344 10. Heat conductivity:1.2 W/M.K Performance: 1.Special for adhesion the heat sink and chip(CPU & IC & LED). Also usually used in the Aluminium base board, SUS, PS, ABS, PP , PC etc. 2. Highly heat-conductive and stickiness, improve the product life, it is the first choice for high-end electronic products. 3. Stable performance and long life, it can work at least 5 years under the normal temperature. 4. Environmental protection. In accordance with SGS / ROHS standard. Mainly customers: LCD, LED, CPU, IC BGA etc electronic industry and Household electric appliance Plant. If any question, please feel free to let us know. T
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